SiC film deposition by DC magnetron sputtering

Citation
L. Gou et al., SiC film deposition by DC magnetron sputtering, THIN SOL FI, 345(1), 1999, pp. 42-44
Citations number
11
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
345
Issue
1
Year of publication
1999
Pages
42 - 44
Database
ISI
SICI code
0040-6090(19990507)345:1<42:SFDBDM>2.0.ZU;2-2
Abstract
SiC film was prepared using sintered SiC target by means of DC magnetron sp uttering. With improving vacuum end insulation between the target and the t arget cover, amorphous SIC aim was obtained with a substrate temperature of 200 degrees C or so. The results that deposition conditions such as gas pr essure, sputtering poor er, substrate-target distance influence deposition rate were given. Finally, the hardness and the resistance-temperature depen dence were also investigated. The maximum absolute hardness of measured sam ples was H, 2410 Kg/mm(2). The resistance of SiC film prepared was sensitiv e to temperature within a measuring temperature range of 40-415 degrees C. (C) 1999 Elsevier Science S.A. All rights reserved.