We have developed a simple process to form epitaxial CoSi2 for shallow junc
tion. Prior to metal deposition, the patterned wafers were treated with HF-
vapor passivation. As observed hy scanning tunneling microscopy (STM), this
HF treatment drastically improves the native oxide-induced surface roughne
ss. The epitaxial behavior was confirmed by cross-sectional transmission el
ectron microscopy (TEM). Decreased sheet resistance and leakage current, an
d improved thermal stability are displayed by the HF treated samples, which
is consistent with STM and TEM results.