Polysilicon thin-film transistors using self-aligned cobalt and nickel silicide source and drain contacts

Citation
Gt. Sarcona et al., Polysilicon thin-film transistors using self-aligned cobalt and nickel silicide source and drain contacts, IEEE ELEC D, 20(7), 1999, pp. 332-334
Citations number
6
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE ELECTRON DEVICE LETTERS
ISSN journal
07413106 → ACNP
Volume
20
Issue
7
Year of publication
1999
Pages
332 - 334
Database
ISI
SICI code
0741-3106(199907)20:7<332:PTTUSC>2.0.ZU;2-L
Abstract
Polysilicon thin-film transistors (TFT's) with island thickness of 20 and 7 0 nm were fabricated with self-aligned cobalt and nickel silicide contacts to the source and drain. The silicide contacts are shown to reduce the seri es resistance, which limits the on-current of the device, thus significantl y increasing the effective mobility in the 20-nm island devices. The mobili ties of 20-nm cobalt and nickel silicided devices are similar to those with 70-nm islands, 31 versus 33 cm(2)/V-s, whereas the nonsilicided 20-nm devi ces have a mobility of only 13 cm(2)/V-s, The island thickness is shown to influence other device parameters affecting active matrix display driver ci rcuit design, such as threshold voltage, leakage current, and subthreshold swing; all these parameters are improved when the island thickness is decre ased.