Ion channeling through the poly-Si gate is investigated using Monte Carte s
imulations. It is shown that even at very low energies, channeling may lead
to dopant penetration through the gate oxide, resulting in large threshold
voltage variations, in particular, of narrow-channel, submicron devices, U
nlike thermally activated dopant diffusion through the gate dielectric that
is severe only in the case of B, direct penetration due to channeling is a
potential problem with all commonly used dopants, The maximum channeling r
ange (minimum poly-Si thickness to prevent dopant penetration) is calculate
d as a function of implant energy for B, P, and As ions.