Channeling of low-energy implanted ions through the poly-Si gate

Citation
G. Hobler et al., Channeling of low-energy implanted ions through the poly-Si gate, IEEE ELEC D, 20(7), 1999, pp. 357-359
Citations number
15
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE ELECTRON DEVICE LETTERS
ISSN journal
07413106 → ACNP
Volume
20
Issue
7
Year of publication
1999
Pages
357 - 359
Database
ISI
SICI code
0741-3106(199907)20:7<357:COLIIT>2.0.ZU;2-4
Abstract
Ion channeling through the poly-Si gate is investigated using Monte Carte s imulations. It is shown that even at very low energies, channeling may lead to dopant penetration through the gate oxide, resulting in large threshold voltage variations, in particular, of narrow-channel, submicron devices, U nlike thermally activated dopant diffusion through the gate dielectric that is severe only in the case of B, direct penetration due to channeling is a potential problem with all commonly used dopants, The maximum channeling r ange (minimum poly-Si thickness to prevent dopant penetration) is calculate d as a function of implant energy for B, P, and As ions.