Deep submicron MOSFET's with elevated source/drain (S/D) structures, where
S/D extension regions were partially elevated besides deep S/D regions, wer
e fabricated by use of Si selective epitaxial growth technique. As fairly c
ompared with a well-developed conventional MOSFET, we clarify an advantage
of the elevated S/D structures, i.e., improvement upon driving performance
with keeping excellent short-channel characteristics, which is enhanced for
decrease in gate sidewall spacer width. The experimental results are expla
ined in terms of the reduction in S/D parasitic resistance by addition of t
he Si epitaxial layer where the impurity profile is suitable.