A 200-mm 0.35-mu m silicon-germanium heterojunction bipolar transistor (SiG
e HBT) technology involving epitaxially-aligned polysilicon emitters is des
cribed. The devices are shown to combine the high speed performances typica
l for poly-Si emitter SiGe base devices (f(max) up to 70 GHz) and the low 1
/f noise properties of monocrystalline emitter structures (noise figure-of-
merit KB as low as 7.2 x 10(-10) mu m(2)). Statistical current gain data ar
e used to demonstrate the manufacturability of this innovative SiGe HBT tec
hnology.