Chip Scale Package (CSP) solder joint reliability and modeling

A viscoplastic constitutive model was used to analyze the thermally induced plastic and creep deformation and low cycle fatigue behavior of the solder joints in Chip Scale Packages (CSP) mounted on Printed Circuit Boards (PCB ). The time-dependent and time-independent viscoplastic strain rate and pla stic hardening work factors of solder material were used in 2-D plane strai n finite element models. The viscoplastic strain rate data was fitted to th e viscoplastic flow equation. The plastic hardening factors were considered in the evolution equation. A viscoelastic constitutive model was used for molding compound. Finite element models, incorporating the viscoplastic flo w and evolution equations for solder and the viscoelastic equations for mol ding compound, were verified by temperature cycling tests on assembled CSPs . The effect of the cyclic frequency, dwell time, and temperature ramp rate on the response of the viscoplastic deformation was studied for a tapeless Lead-on-Chip (LOC) CSP and a flexible substrate CSP. The ramp rate signifi cantly affects the equivalent stress range in solder joints while a dwell t ime in excess of 10 min pet half cycle does not result in increased strain range. The failure data from the experiments was fitted to the Weibull fail ure distribution and the Weibull parameters were extracted. After satisfact ory correlation between the experiment and the model was observed, the effe ct of material properties and package design variables on the fatigue life of solder joints in CSPs was investigated and the primary factors affecting solder fatique life were subsequently presented. Furthermore. a simplified model was proposed to predict the solder fatigue life in CSPs. (C) 1999 El sevier Science Ltd. All rights reserved.