Dual-column (FIB-SEM) wafer applications

The enhanced capabilities of a dual-column system are quickly becoming real ized by the semiconductor industry for performing a wide range of applicati ons on full wafer samples. A dual-column system integrates the capabilities of an electron column for scanning electron microscopy, and a focused ion beam (FIB) column for milling and depositing materials. An ideal dual-colum n system is able to perform all of the functions of a single-beam system, w hile enhancing the capabilities by operating the columns concurrently. Some of the applications where a dual-column system has an advantage over a sin gle-beam system include material deposition, TEM sample preparation, defect characterization, and process control. By combining the modification capab ilities of an FIB and the non-destructive imaging of the electron column, t he dual-column system will become an important tool not only in the failure analysis laboratory but also in the fabrication facility. (C) 1999 Elsevie r Science Ltd. All rights reserved.