Nanometer patterning of single crystalline CoSi2 layers on Si(100) by local
oxidation was studied. Epitaxial CoSi2 layers with thicknesses around 20 n
m were grown on Si(100) by molecular beam allotaxy. A nitride layer was dep
osited on the surface of the silicide and subsequently patterned along the
(110) direction by optical lithography and dry etching. Rapid thermal oxida
tion was then performed at a temperature of 950 degrees C in dry O-2 ambien
t. During oxidation SiO2 forms on the unprotected regions of the CoSi2 laye
r. The silicide in this region is pushed into the substrate. Near the edges
of the nitride mask the silicide layer thins and finally separates from th
e protected part. Using this patterning method highly uniform gaps with a w
idth of 70 nm between the two silicide layers have been obtained. It was sh
own that the separation gap is not only dependent on the oxidation paramete
rs, but also on the thickness and the width of the nitride mask due to the
stress effects. Possible applications of this new technique are discussed.
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