Resistivity and structural defects of reactively sputtered TiN and HfN films

Citation
Y. Ando et al., Resistivity and structural defects of reactively sputtered TiN and HfN films, THIN SOL FI, 344, 1999, pp. 246-249
Citations number
9
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
344
Year of publication
1999
Pages
246 - 249
Database
ISI
SICI code
0040-6090(199904)344:<246:RASDOR>2.0.ZU;2-Y
Abstract
TiN and HfN thin films have been deposited by reactive r.f.-sputtering in a n Ar-N-2 gas mixture under different condition of total gas pressure (P-T) from 0.7 Pa to 5.3 Pa. Thin him X-ray diffraction studies show that the str ucture of the TiN films is gradually changed from TiN f.c.c. structure to a morphous with increasing P-T. On the other hand, HfN f.c.c. structure with a strong (111)-preferred orientation is formed for all HfN films prepared w ith various P-T The resistivity of the films at room temperature (rho(RT)) increased with increasing P-T in different ways between TiN and HfN. The fi lms with rho(RT) less than or equal to 0.3 m Omega m show root T dependence in conductivity at low temperature. HfN films with rho(RT) = 1.6 m Omega m , the largest one measured, show an insulating behavior. The magnetoconduct ance Delta sigma(H) measurements showed that the spinorbit coupling of HfN is found to be stronger than that of TIN. (C) 1999 Elsevier Science S.A. Al l rights reserved.