A new design hierarchy in TCAD is discussed with emphasis on a design of IC
interconnects and gate patterns. Two design methodologies for gate pattern
s at a CMOS cell level and multilevel interconnect scheme at a chip level a
re proposed. This approach generates the layout design rules of gate patter
ns, considering the fabrication process and pattern layout dependency, and
allows a design of multilevel interconnect scheme at the initial phase of t
echnology development.