The effect of annealing on Al diffusion through a TIN, barrier on a Si(100)
wafer has been studied with Al K-edge and L-3,L-2-edge absorption spectros
copy as a function of annealing temperature (400 degrees C - 600 degrees C)
. It is found that there is a noticeable change at high temperatures in the
Al K- and L-3,L-2-edge spectra as the temperature increases. This observat
ion is attributed to the formation of a stable protective surface oxide. Fl
uorescence yield shows that most of the Al metal remains intact after annea
ling.