Di. Kong et al., Effects of coupling agent thickness on residual stress in polyimide/gamma-APS/silicon wafer joints, J ADHES SCI, 13(7), 1999, pp. 805-818
The adhesion strength of and the residual stress in pyromellitic dianhydrid
e-4,4' -oxydianiline polyimide (PMDA-ODA PI)/ gamma-APS / silicon wafer joi
nts were investigated for various coating thicknesses of gamma-aminopropylt
riethoxysilane (gamma-APS). The largest adhesion strength (780 N/m) was obs
erved in the joint with 11 nm of gamma-APS coating thickness. The residual
stress was measured by a He-Ne laser thin film stress analyzer and calculat
ed by a finite element analysis. The residual bending stresses obtained by
finite element calculations agreed very well with the experimental results.
Residual stress increased with increasing gamma-APS coating thickness.