THERMAL-CONDUCTIVITIES OF HYPOEUTECTIC AL-CU ALLOYS DURING SOLIDIFICATION AND COOLING

The thermal conductivity of hypoeutectic Al-Cu alloys during solidific ation and cooling was estimated by combining available data on electri cal resistivity and thermal conductivity. To estimate the thermal cond uctivity of the solid alloys, the Smith-Palmer equation was used. This equation enables one to closely estimate the thermal conductivities f rom known data on electrical conductivities. The electrical resistivit ies of Al-Cu melts were also gathered. The Smith-Palmer equation was t ested successfully for pure Al-melt and assumed to apply to AI-Cu melt s, so that their thermal conductivities could be estimated. Finally si mple-mixture models were applied to estimate the electrical resistivit ies and thermal conductivities of the alloys during solidification. (C ) 1997 Elsevier Science S.A.