Decreasing the optical path length in an optoelectronic module using silicon micromachining

In order to decrease the optical path length of an optoelectronic module, t wo ways of achieving 45 degrees silicon mirrors with trenches defining the mirror size are presented: dicing, and dry etching. The dicing was performe d with a Disco DAD 361 dicing machine. To define the dry etched trench UV-l ithography on electrodeposited resist was used. The electrodeposition was p erformed using commercially available positive photoresist PEPR 2400 from S hipley Ltd.