Potentialities of a new positive photoresist for the realization of thick moulds

The fabrication of MEMS by using the technique of electrodeposition inside resist moulds has known a large development in recent years. Recently, Clar iant has produced a new positive photoresist, AZ 9260(R) (500 cps), aimed a t the realization of such thick moulds. In this paper, we describe the excellent characteristics of this product th rough the use of our original method to control technological parameters. T he most important feature of AZ 9260(R) photoresist is its good transparenc y. Current results, using a standard mask aligner, give a good aspect ratio (height-width) of up to 15 easily for 100 mu m thick moulds and up 20 occa sionally and our measurement method of transparency predicts the potential realization of mould thickness up to 150 mu m in one UV exposure.