Jm. Lee et al., Microstructural changes in Al-Cu-Mn alloy reinforced with SiC particles onholding at high temperatures, MATER T JIM, 40(6), 1999, pp. 537-545
The microstructural changes were investigated in an Al-Cu-Mn alloy reinforc
ed with SiC particles after being kept in the liquid or semi-solid state. T
he microstructural and compositional changes were characterized by differen
tial thermal analysis (DTA), X-ray diffraction, and scanning electron micro
scopy (SEM) equipped with an energy dispersive X-ray analysis (EDXA) system
. The solidification behavior of the monolithic alloy is followed by the Al
-Cu-Mn ternary system while its composites showed the Al-Cu-Mn-Si quaternar
y system due to the rejection of Si from SiC particles after being kept in
the liquid or semi-solid state. SiC particles were attacked heavily and a l
arge amount of reaction product, Al4C3 was formed. The extent of reaction w
as calculated from the contents of Si in matrix by the DTA method for deter
mining the liquidus. The result was compared with the quantitative metallog
raphy.