As. Gullerud et al., Three-dimensional modeling of ductile crack growth in thin sheet metals: computational aspects and validation, ENG FRACT M, 63(4), 1999, pp. 347-374
This work describes the development of two types of three-dimensional (3D)
finite element models to predict stable, Mode I crack growth in thin, ducti
le aluminum alloys, The two presented models extend the standard 2D form of
the Crack Tip Opening Angle (CTOA) methodology, which determines crack ext
ension based on obtaining a critical angle at the crack tip. The more gener
al 3D model evaluates the CTOA at each node along the crack front which ena
bles the development of tunneled profiles. The alternative, constant front
approach, enforces uniform growth along the crack front, thereby growing th
e crack in a self-similar manner. For the constant front approach, evaluati
on of the CTOA occurs at a specified distance behind the crack front which
decouples CTOA evaluation from mesh refinement. Both CTOA-based models incl
ude adaptive load control strategies to minimize the effects of discrete Lo
ad increments on the growth response, Example analyses demonstrate that the
more general 3D approach requires cube-shaped elements on the crack plane
to eliminate a bias in growth directions, To evaluate the effectiveness of
the constant front approach, this work also describes a validation study us
ing loadcrack extension data from 2.3 mm thick Al 2024-T3 specimens tested
at NASA-Langley. The test matrix includes C(T) and M(T) specimens, with var
ying widths (50-600 mm), a/W ratios, and levels of mechanical restraint to
suppress out-of-plane bending, Comparisons of load-crack extension curves f
rom experiments and analyses of a 150 mm C(T) specimen, with out-of-plane b
ending prevented, provide a calibrated (critical) CTOA value of 5.1 degrees
, Analyses using the calibrated CTOA value and the constant front approach
provide predictions of peak load for constrained and unconstrained specimen
s in good agreement with the experimental values, (C) 1999 Elsevier Science
Ltd, All rights reserved.