Electrically conductive adhesives and underfills - Foreword

Authors
Morris, JE
Citation
Je. Morris, Electrically conductive adhesives and underfills - Foreword, IEEE T COMP, 22(2), 1999, pp. 139-140
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN journal
15213331 → ACNP
Volume
22
Issue
2
Year of publication
1999
Pages
139 - 140
Database
ISI
SICI code
1521-3331(199906)22:2<139:ECAAU->2.0.ZU;2-G