Chemical kinetic model of interfacial degradation of adhesive joints

Citation
Dcc. Lam et al., Chemical kinetic model of interfacial degradation of adhesive joints, IEEE T COMP, 22(2), 1999, pp. 215-220
Citations number
8
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN journal
15213331 → ACNP
Volume
22
Issue
2
Year of publication
1999
Pages
215 - 220
Database
ISI
SICI code
1521-3331(199906)22:2<215:CKMOID>2.0.ZU;2-U
Abstract
Mechanical properties of adhesive joints are degraded in the presence of wa ter. The progressive decrease in strength has been attributed to propagatio n of interfacial crack. Water diffusion and stress distribution within adhe sive joint as a function of time has been modeled using finite element in t his study, The stress history at the interface displayed spatially invarian t characteristics similar to that of interfacial water concentration variat ion as a function of diffusion. The water-stress history along the interfac e can be modeled as a function dependent principally on water concentration without dependence on position. On this basis, a chemical kinetic model is proposed to explain the joint strength degradation data reported in litera ture.