Thermal investigations of ICs and microstructures (THERMINIC) - Foreword

Authors
Blackburn, DL Courtois, B
Citation
Dl. Blackburn et B. Courtois, Thermal investigations of ICs and microstructures (THERMINIC) - Foreword, IEEE T COMP, 22(2), 1999, pp. 229-230
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN journal
15213331 → ACNP
Volume
22
Issue
2
Year of publication
1999
Pages
229 - 230
Database
ISI
SICI code
1521-3331(199906)22:2<229:TIOIAM>2.0.ZU;2-9