Validation and application of different experimental techniques to measureelectronic component operating junction temperature

Increasing power densities and changing component design have brought about the need for accurate measurement of die junction temperature,While many j unction temperature measurement techniques exist it is difficult to compare their relative performance. To validate the accuracy of various direct and indirect test methods, the operating junction temperature of board-mounted SO-16 and plastic quad flat packs (PQFP)-160 components has been recorded using standard thermal test die. Numerical analysis was also used to predic t junction temperature and component temperature gradients. The performance of each technique was evaluated for accuracy, ease of use and relevance to real applications. Once accuracy had been validated, two indirect measurem ent techniques were applied simultaneously to identify the magnitude of loc alized hot-spots generated by nonuniform power dissipation on the PQFP die.