Yj. Kim et Mg. Allen, In situ measurement of mechanical properties of polyimide films using micromachined resonant string structures, IEEE T COMP, 22(2), 1999, pp. 282-290
Citations number
10
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Two irt situ measurement schemes, using micromachined resonant string struc
tures, for the measurement of the polyimide residual stress and polyimide/m
etal adhesion durability have been developed. The residual stress of polyim
ide films, DuPont PI-2555 and PI-2611, have been measured using a bulk micr
omachined string structure. According to the Rayleigh's method, the resonan
t frequency of a polyimide string can be related to the film stress. By mea
suring the resonant frequency of these polyimide strings, the residual stre
sses have been calculated. The measurement results of various strings have
been compared with conventional measurement results, which shows that they
are in good agreement,
Also, a noble scheme to quantize the adhesion durability between a polyimid
e film and a metal film has been developed. This scheme is based on a polyi
mide/metal bimorph string structures, fabricated using a surface micromachi
ning technique, vibrating with an alternating potential, The change of reso
nance profile of this string structure can be related to the degradation of
adhesion strength at the polyimide/metal interface. Various polyimide/gold
string structures have been fabricated using a surface micromachining with
Cu sacrificial layers, and the resonant qualities have been monitored. Not
able changes of resonant Q-factor and resonant frequency, due to the degrad
ation of adhesion between the metal and polyimide, have been observed after
10(8) cycles (string vibration) for the polyimide/gold bimorph strings. Th
e changes of resonant Q-factor and resonant frequency over a time period (v
ibration cycles) have been monitored.