Experiments on low velocity cooling of high conductivity substrates

Citation
Kk. Sikka et al., Experiments on low velocity cooling of high conductivity substrates, IEEE T COMP, 22(2), 1999, pp. 307-315
Citations number
39
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN journal
15213331 → ACNP
Volume
22
Issue
2
Year of publication
1999
Pages
307 - 315
Database
ISI
SICI code
1521-3331(199906)22:2<307:EOLVCO>2.0.ZU;2-6
Abstract
Experiments are reported on low velocity cooling of a heater-on-substrate g eometry for high conductivity substrate materials, Four different substrate materials were studied: 1) aluminum 6061-T6; 2) aluminum nitride; 3) alumina; 4) FR-4. The effects of combined buoyancy and forced air flow, geometric orientation , substrate size, thermal conductivity, and emittance on heat transfer are evaluated. Results define the performance of the substrates and the limits of conjugate mixed convection for horizontal substrates, and of orientation effects for substrates tilted from buoyancy-opposing to buoyancy-assisting orientations, An analytical approximation is described that predicts the e xperimental data with good accuracy over broad parameter ranges.