Inductively coupled plasma-enhanced chemical vapor deposition of SiO2 and GeO2-SiO2 films for optical waveguides using tetraethylorthosilicate and tetramethylgermanium
T. Hattori et al., Inductively coupled plasma-enhanced chemical vapor deposition of SiO2 and GeO2-SiO2 films for optical waveguides using tetraethylorthosilicate and tetramethylgermanium, JPN J A P 1, 38(5A), 1999, pp. 2775-2778
SiO2 and GeO2-SiO2 films have been deposited by employing inductively coupl
ed plasma-enhanced chemical Vapor deposition (ICP-CVD) from tetraethylortho
silicate (TEOS) and oxygen discharge using tetramethylgermanium (TMGe) as a
dopant. A pure SiO2 film deposited with TEOS:O-2 at a flow rate ratio of 1
7% and an operating pressure of 5 Pa showed a low wetetching rate of 114 nm
/min approaching that of a thermally grown oxide. Ge doped SiO2 films were
deposited at various TMGe flow rates, and it was found that Ge was incorpor
ated into the him as a replacement for Si. The refractive index of the film
is in proportion to the Ge content in the film. Fourier transform infrared
(FTIR) analysis confirmed that there were few O-H and C-H defects in the f
ilms. Optical waveguides were fabricated using ICP-CVD and reactive ion etc
hing (RIE). A propagation loss of 0.027 dB/cm at 1.55 mu m was achieved for
the optical waveguide by using GeO2-SiO2 film as the core layer.