Comparison of techniques for bonding VCSELS directly to ICs

This paper reports the successful bonding of 8 x 8 and 4 x 4 VCSEL arrays t o Si CMOS and GaAs MESFET integrated circuits and to GaAs substrates. Three different bonding techniques are demonstrated and their electrical, optica l and mechanical characteristics are compared. All three techniques remove the substrate from the VCSEL wafer, leaving individual VCSELs bonded direct ly to locations within the integrated circuit.