An overview of manufacturing yield and reliability modeling for semiconductor products

This paper presents an overview' of yield, reliability, bum-in, cost factor s, and fault coverage as practiced in the semiconducted manufacturing indus try. Reliability and yield modeling can be used as a foundation for develop ing effective stress burn-in, which in turn can warranty high-quality semic onductor products. Yield models ar-e described and their advantages and dis advantages are discussed. Both yield-reliability relationships and relation models between yield and reliability are thoroughly analyzed in regard to their importance to semiconductor products.