Pt/(Ba, Sr)TiO3/Pt capacitors fabricated by sputtering technique showe
d abnormally higher leakage current when negative bias was applied to
the top electrode. In this letter, two kinds of processes were attempt
ed to reduce high leakage current of Pt/BST/Pt capacitors for dynamic
random access memory devices: (1) postannealing under O-2 atmosphere a
nd (2) adding oxygen into sputtering gas of platinum top electrode. Th
ese processes were very effective to reduce the oxygen vacancy in the
BST films which are mostly responsible for such a high leakage current
. The higher reverse currents were significantly lowered by these proc
esses, so that we could obtain symmetric current versus voltage curves
of Pt/BST/Pt capacitors. (C) 1997 American Institute of Physics.