Large diameter silicon technology and epitaxy

Citation
H. Yamagishi et al., Large diameter silicon technology and epitaxy, MICROEL ENG, 45(2-3), 1999, pp. 101-111
Citations number
13
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
45
Issue
2-3
Year of publication
1999
Pages
101 - 111
Database
ISI
SICI code
0167-9317(199907)45:2-3<101:LDSTAE>2.0.ZU;2-W
Abstract
The intermediate results of Super Silicon Crystal project are introduced to serve a production platform of 400 mm silicon. SSi has already installed a 400 mm CZ furnace. Raw materials are sufficiently applicable for 36 inch h ot zone. We discuss a contact part between a crystal suspending system and a subsidiary cone. A successful handling system for a fragile quartz crucib le and for a heavy silicon crystal is also described. A wire saw for 400 mm wafers has already been installed in SSi and sliced 400 mm wafers are demo nstrated. For 400 mm epitaxial wafers, we describe pretreatment for epitaxi al growth at low temperature. (C) 1999 Elsevier Science B.V. All rights res erved.