Citation
Bm. Ocko et al., Thickness induced buckling of bcc copper films, PHYS REV L, 83(4), 1999, pp. 780-783
Citations number
17
Categorie Soggetti
Physics
Journal title
PHYSICAL REVIEW LETTERS
ISSN journal
00319007
→ ACNP
Volume
83
Issue
4
Year of publication
1999
Pages
780 - 783
Database
ISI
SICI code
0031-9007(19990726)83:4<780:TIBOBC>2.0.ZU;2-F
Abstract
Copper films electrodeposited on Au(100) develop a buckling instability aft
er the 11th layer leading to stripes with a 60-75 Angstrom period. Analysis
of the x-ray diffraction data shows that the entire copper him restructure
s by forming regions which are locally orthorhombic in a spatially modulate
d pattern. This distortion is supported by first-principles calculations.