Dielectric property and microstructure of a porous polymer material with ultralow dielectric constant

This letter reports the synthesis and dielectric properties of a porous pol y(arylethers) material with an ultralow dielectric constant for interlayer dielectric applications in microelectronics. The porous polymer films were fabricated by a method of organic phase separation and evaporation. A diele ctric constant of 1.8 was achieved for a porous film with an estimated poro sity of 40%. The characterization of microstucture for the porous film show ed numerous nanopores with an average size of 3 nm distributed uniformly th roughout the film. (C) 1999 American Institute of Physics. [S0003-6951(99)0 1832-X].