P. Lennon et al., Influence of microwave plasma treatment on the wettability and the adhesive properties of polyamides films with an epoxy resin, INT J ADHES, 19(4), 1999, pp. 273-279
Microwave plasma surface treatments of polyamides films, PA11 and PA12, hav
e been carried out. Two treatments were used: ammonia and nitrogen/oxygen m
ixtures. Chemical and physical modifications of the surface were investigat
ed by X-ray photoelectron spectroscopy and wettability measurements. The ad
hesion of the polyamide films with two epoxy adhesives was studied using a
series of different tests in parallel: three-point bending test, pull-off t
est and lap-shear test. The wettability and adhesive properties were shown
to improve greatly after plasma treatment, especially for the nitrogen/oxyg
en mixture. (C) 1999 Elsevier Science Ltd. All rights reserved.