Influence of microwave plasma treatment on the wettability and the adhesive properties of polyamides films with an epoxy resin

Citation
P. Lennon et al., Influence of microwave plasma treatment on the wettability and the adhesive properties of polyamides films with an epoxy resin, INT J ADHES, 19(4), 1999, pp. 273-279
Citations number
15
Categorie Soggetti
Material Science & Engineering
Journal title
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
ISSN journal
01437496 → ACNP
Volume
19
Issue
4
Year of publication
1999
Pages
273 - 279
Database
ISI
SICI code
0143-7496(1999)19:4<273:IOMPTO>2.0.ZU;2-4
Abstract
Microwave plasma surface treatments of polyamides films, PA11 and PA12, hav e been carried out. Two treatments were used: ammonia and nitrogen/oxygen m ixtures. Chemical and physical modifications of the surface were investigat ed by X-ray photoelectron spectroscopy and wettability measurements. The ad hesion of the polyamide films with two epoxy adhesives was studied using a series of different tests in parallel: three-point bending test, pull-off t est and lap-shear test. The wettability and adhesive properties were shown to improve greatly after plasma treatment, especially for the nitrogen/oxyg en mixture. (C) 1999 Elsevier Science Ltd. All rights reserved.