Thermally induced changes in the optical properties of SiNx : H films deposited by the electron cyclotron resonance plasma method

Citation
Fl. Martinez et al., Thermally induced changes in the optical properties of SiNx : H films deposited by the electron cyclotron resonance plasma method, J APPL PHYS, 86(4), 1999, pp. 2055-2061
Citations number
36
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF APPLIED PHYSICS
ISSN journal
00218979 → ACNP
Volume
86
Issue
4
Year of publication
1999
Pages
2055 - 2061
Database
ISI
SICI code
0021-8979(19990815)86:4<2055:TICITO>2.0.ZU;2-G
Abstract
We analyze the effect of thermal processes on the optical properties (refra ctive index, optical gap, Tauc coefficient, and Urbach energy) of SiNx:H fi lms. Films with three different nitrogen to silicon ratios (x = 0.97, x = 1 .43, and x = 1.55, respectively) were deposited by a chemical vapor deposit ion technique assisted by an electron cyclotron resonance generated plasma. After deposition they were subjected to rapid thermal annealing at tempera tures ranging from 300 degrees C to 1050 degrees C. We found that the perco lation threshold for Si-Si bonds (at x = 1.1) separates films with differen t response to thermal treatments. The changes of the Tauc coefficient and t he Urbach energy at moderate annealing temperatures indicate a structural r elaxation of the network for the films with x above the percolation thresho ld, while at higher temperatures the trends are inverted. In the case of x below the percolation limit the inversion point is not observed. These tren ds are well correlated with the width of the Si-N infrared stretching absor ption band. Additionally the samples with as-grown x = 1.43 show a good cor relation between the Urbach energy and the density of unpaired spins in sil icon dangling bonds. (C) 1999 American Institute of Physics. [S0021-8979(99 )08016-0].