Fl. Martinez et al., Thermally induced changes in the optical properties of SiNx : H films deposited by the electron cyclotron resonance plasma method, J APPL PHYS, 86(4), 1999, pp. 2055-2061
We analyze the effect of thermal processes on the optical properties (refra
ctive index, optical gap, Tauc coefficient, and Urbach energy) of SiNx:H fi
lms. Films with three different nitrogen to silicon ratios (x = 0.97, x = 1
.43, and x = 1.55, respectively) were deposited by a chemical vapor deposit
ion technique assisted by an electron cyclotron resonance generated plasma.
After deposition they were subjected to rapid thermal annealing at tempera
tures ranging from 300 degrees C to 1050 degrees C. We found that the perco
lation threshold for Si-Si bonds (at x = 1.1) separates films with differen
t response to thermal treatments. The changes of the Tauc coefficient and t
he Urbach energy at moderate annealing temperatures indicate a structural r
elaxation of the network for the films with x above the percolation thresho
ld, while at higher temperatures the trends are inverted. In the case of x
below the percolation limit the inversion point is not observed. These tren
ds are well correlated with the width of the Si-N infrared stretching absor
ption band. Additionally the samples with as-grown x = 1.43 show a good cor
relation between the Urbach energy and the density of unpaired spins in sil
icon dangling bonds. (C) 1999 American Institute of Physics. [S0021-8979(99
)08016-0].