Preliminary studies in the processing and characterization of Al2O3/SnO2 laminated composites

Citation
Gm. Gladysz et al., Preliminary studies in the processing and characterization of Al2O3/SnO2 laminated composites, J MATER SCI, 34(17), 1999, pp. 4351-4355
Citations number
8
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE
ISSN journal
00222461 → ACNP
Volume
34
Issue
17
Year of publication
1999
Pages
4351 - 4355
Database
ISI
SICI code
0022-2461(1999)34:17<4351:PSITPA>2.0.ZU;2-Y
Abstract
All oxide composites (reinforcement and matrix both being oxides) exhibit h igh temperature oxidation resistance in addition to high strength and hardn ess. A major drawback of these materials is that the oxide fiber and oxide matrix tend to react, which strengthens the interface and therefore drastic ally reduces the damage tolerance. To overcome this problem, a mechanically weak interphase material, which also serves as a diffusion barrier, is gen erally used. One such materials system is tin dioxide (SnO2) in alumina-bas ed composites. Previous attempts to fabricate such alumina matrix composite s have been unsuccessful due to the higher temperatures needed to densify A l2O3 coupled with the fact that SnO2 decomposes to SnO in reducing environm ents. SnO has a relatively low melting point (1125 degrees C). In this pape r we report the successful fabrication of Al2O3/SnO2, laminated composites and some observations on microstructural and mechanical characterization of the laminates. As expected from the phase diagram, no chemical compound fo rmation was observed between Al2O3 and SnO2 which means that no primary che mical bonding developed between individual laminae. TEM observations showed , however, a strong mechanical interlocking at the SnO2/Al2O3 interfaces. I n spite of the relatively strong interfacial bond, cracks did deflect. Our microstructural studies showed that SnO2 served as a weak interphase materi al. (C) 1999 Kluwer Academic Publishers.