Slow crack growth analysis of brittle materials with finite thickness subjected to constant stress-rate flexural loading

Citation
Sr. Choi et Jp. Gyekenyesi, Slow crack growth analysis of brittle materials with finite thickness subjected to constant stress-rate flexural loading, J MATER SCI, 34(16), 1999, pp. 3875-3882
Citations number
20
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE
ISSN journal
00222461 → ACNP
Volume
34
Issue
16
Year of publication
1999
Pages
3875 - 3882
Database
ISI
SICI code
0022-2461(1999)34:16<3875:SCGAOB>2.0.ZU;2-G
Abstract
A two-dimensional, numerical analysis of slow crack growth (SCG) was perfor med for brittle materials with finite thickness subjected to constant stres s-rate ("dynamic fatigue") loading in flexure. The numerical solution showe d that the conventional, simple, one-dimensional analytical solution can be used with a maximum error of about 5% in determining the SCG parameters of a brittle material with the conditions of a normalized thickness (a ratio of specimen thickness to initial crack size) T > 3.3 and of a SCG parameter n greater than or equal to 10. The change in crack shape from semicircular to elliptical configurations was significant particularly at both low stre ss rate and low T, attributed to predominant difference in stress intensity factor along the crack front. The numerical solution of SCG parameters was supported within the experimental range by the data obtained from constant stress-rate flexural testing for soda-lime glass microslides at ambient te mperature. (C) 1999 Kluwer Academic Publishers.