Adhesion of sputtered copper to photosensitive epoxies

Citation
G. Sarkar et Bk. Hong, Adhesion of sputtered copper to photosensitive epoxies, J MAT SCI L, 18(12), 1999, pp. 991-994
Citations number
9
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE LETTERS
ISSN journal
02618028 → ACNP
Volume
18
Issue
12
Year of publication
1999
Pages
991 - 994
Database
ISI
SICI code
0261-8028(199906)18:12<991:AOSCTP>2.0.ZU;2-9