Multilayer polyimide film substrates for interconnections in microsystems

Currently there is a great interest in flexible substrates for their use in the packaging of semiconductors. They allow high packaging density and per mit mechanical motion of the components, if necessary. This paper describes a new substrate material which possesses a high flexibility and which can be used for the realization of interconnection cables and MCM-D. These subs trates are not only highly flexible but also mechanically stable, chemicall y inert and can be produced with the same processes as those for rigid subs trates.