Applications and simulation of unconventional bulk-micromachining using underetching of {100} silicon planes

In this paper we present the principle and feasibility of bulk-micromachini ng using underetching of vertical {1 0 0} Silicon planes. Beside the demons tration of realized devices we investigate the fabrication reproducibility of these devices by simulating the anisotropic etching process for differen t cases of mask misalignment and crystal misorientation of the silicon wafe r. Devices fabricated by the proposed etching technique can be reproduced w ithin variations in mechanical performance lower than 3% if precautions suc h as an adapted design or pre-etching are considered.