Effects of SiCp reinforcement by electroless copper plating on properties of Cu/SiCp composites

Silicon carbide reinforced copper matrix composites containing 50-80 vol.-% SiCp were fabricated by hot pressing copper coated SIG, powder. The results show that the densification, thermal expansion coefficients, flexural stre ngth, and thermal conductivity of Cu/SiCp composites reinforced by electrol ess copper plating and their corrosion resistance in 5%NaCl solution are be tter than those without electroless plating. Physical properties and flexur al strength of the composites decrease with an increase in SIG, content, wh ereas the corrosion resistance increases with an increase in SiCp volume fr action. By observing the Fracture surface after a flexural test, it can be seen there are two types of fracture model: the cracking of Cu/SiCp interfa ce and the pulling out of SiCp particles. The experiment also proved that t he bonding strength of the Cu/SiCp interface and the pressure of the hot pr essing operation are the two main factors which influence the fracture of t hese composites.