Copper single-crystals are grown by a galvanic method, using etched ion tra
cks in a polymer foil as templates. The copper deposition is carried out by
reversible pulse electrolysis in an ultrasonic field. The method applied f
or this purpose permits fabrication of stable standing cylindrical single c
rystals with diameters in the nanometer and micrometer range with high aspe
ct ratio and density of 10(5)-10(7) per cm(2) on a large area. The experime
ntal results obtained in this way are compared with the results obtained by
direct current plating under ultrasonic treatment and sole reversible elec
trolysis. The effects of all these deposition processes on the structure of
copper claddings are shown.