Hard hydrogenated carbon films with low stress

Citation
Rg. Lacerda et Fc. Marques, Hard hydrogenated carbon films with low stress, APPL PHYS L, 73(5), 1999, pp. 617-619
Citations number
27
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
73
Issue
5
Year of publication
1999
Pages
617 - 619
Database
ISI
SICI code
0003-6951(19990803)73:5<617:HHCFWL>2.0.ZU;2-L
Abstract
Analysis of hard a-C:H films with low stress prepared by methane plasma dec omposition is reported. Films with hardness as high as 14 GPa and stress as low as 0.5 GPa were obtained. These films have a high Raman I-d/I-g ratio (similar to 1.0), and small Tauc's band gap (similar to 0.4 eV). This lette r also supplies strong evidence that the subimplantation deposition model, used to explain the formation of ta-C and ta-C:H films, is also valid for a -C:H films deposited by methane plasma decomposition. It is proposed that t he rigidity of the films is basically provided by a matrix of dispersed cro ss-linked sp(2) sites, in addition to the contribution of the sp(3) sites. (C) 1998 American Institute of Physics. [S0003-6951(98)02431-0].