ISO 10303-based PCB assembly data model for assembly analysis

Today, time is one of the key factors in making a company the best in its i ndustry. Translating information correctly and efficiently would reduce the time required to communicate between departments not only within a company but also among different companies. STEP, comprising many application prot ocols, is a standard for the exchange of product model data that has a grea t capability for describing product shape and managing product life cycle i nformation. Therefore, effective information translation and the Concurrent Engineering (CE) could be achieved using STEP enabling technology. AP 210, an ISO/STEP committee drafted document, is an application protocol that de scribes printed circuit board (PCB) and PCB assembly product data. This pap er focuses on the standard data modeling of PCB assembly based on AP 210. T he data models are implemented as object classes and used to demonstrate th e evaluation analysis application of the PCB assembly.