Sd. Leith et Dt. Schwartz, Through-mold electrodeposition using the uniform injection cell (UIC): Workpiece and pattern scale uniformity, ELECTR ACT, 44(23), 1999, pp. 4017-4027
We report on the operation of an electroplating device based on the uniform
injection cell (UIC) concept. Workpiece scale mass transfer characteristic
s are explored using limiting current measurements and are related to theor
etical predictions. Results show that the device delivers predictable and c
ontrolled average mass transfer rates at the workpiece length scale. Patter
n scale uniformity is explored by electrodeposition of NiFe microgears on t
o a patterned substrate. Statistical analysis of compositional differences
between an electroplated NiFe film and electrodeposited NiFe microgears is
used to explore mass transfer on the pattern scale, Results illustrate that
the presence of a patterned mold influences the average mass transfer rate
compared to the unpatterned electrode, but does not create additional vari
ability in electrolyte mixing across the substrate, Implications for using
the device in through-mold plating are discussed and future improvements to
the device are suggested. (C) 1999 Elsevier Science Ltd, All rights reserv
ed.