Smart integration and packaging of 2-D VCSEL's for high-speed parallel links

This paper reviews recent progress in the integration and packaging of two- dimensional (2-D) vertical-cavity surface-emitting laser (VCSEL) arrays bei ng developed for the use in high-speed parallel optical interconnections. I t reviews the smart integration of VCSEL's with detecting, switching and la tching functions through the integration of a VCSEL-thyristor and double-ca vity phototransistor, It also describes self-alignment-packaging technologi es for 2-D VCSEL module that can be used in high-density parallel links. Va rious system applications, such as a distributed fiber switch used to enabl e crossbar interconnections with address switching functions and hyper-para llel transmission using an image fiber, are also examined.