Stability and uniformity of planar high temperature Josephson junctions fabricated using nanolithography and ion damage

Citation
As. Katz et al., Stability and uniformity of planar high temperature Josephson junctions fabricated using nanolithography and ion damage, IEEE APPL S, 9(2), 1999, pp. 3005-3007
Citations number
18
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
ISSN journal
10518223 → ACNP
Volume
9
Issue
2
Year of publication
1999
Part
3
Pages
3005 - 3007
Database
ISI
SICI code
1051-8223(199906)9:2<3005:SAUOPH>2.0.ZU;2-M
Abstract
We have investigated the room temperature stability and the critical curren t uniformity of planar thin film YBa2Cu3O7-delta Josephson junctions. The j unctions were fabricated using electron-beam lithography to define a stenci l structure followed by ion damage from a conventional 200 keV ion implante r. Using this technique, we have fabricated junctions with weak link length s of 20 - 100 nm that showed classical de and ac Josephson effects at 77 K. By a suitable choice of damage and stencil width, these devices may be tun ed to operate at any temperature between 1 K and the bulk transition temper ature, and they may be placed anywhere on a wafer, providing a high degree of flexibility for circuit applications. Results obtained over several mont hs showed a high level of room temperature stability, and the uniformity of the junctions was maintained.