Characterization of grain boundaries in YBa2Cu3Oy bicrystal junctions

Citation
Hw. Yu et al., Characterization of grain boundaries in YBa2Cu3Oy bicrystal junctions, IEEE APPL S, 9(2), 1999, pp. 3101-3104
Citations number
17
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
ISSN journal
10518223 → ACNP
Volume
9
Issue
2
Year of publication
1999
Part
3
Pages
3101 - 3104
Database
ISI
SICI code
1051-8223(199906)9:2<3101:COGBIY>2.0.ZU;2-8
Abstract
I-V, V-Phi characteristics and atomic force images of grain boundary Joseph son junctions fabricated on SrTiO3, bicrystal substrates were investigated. The half integer Shapiro steps and I, versus B curves show evidence of the inhomogeneous current distribution along the grain boundary junction, The de SQUID formed on the grain boundary shows the expected V-Phi curve. The A FM images, R-T curves and IcRn product reveal sequential destructive deteri oration of the junction originating from the underlying grooved substrate, The results are discussed.