Machine-aligned fabrication of submicron SIS tunnel junctions using a focused ion beam

Citation
Rb. Bass et al., Machine-aligned fabrication of submicron SIS tunnel junctions using a focused ion beam, IEEE APPL S, 9(2), 1999, pp. 3240-3243
Citations number
4
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
ISSN journal
10518223 → ACNP
Volume
9
Issue
2
Year of publication
1999
Part
3
Pages
3240 - 3243
Database
ISI
SICI code
1051-8223(199906)9:2<3240:MFOSST>2.0.ZU;2-X
Abstract
The objective of our research is to develop a machine-aligned technique for the definition and insulation of Nb/Al-AlOx/Nb superconducting-insulating- superconducting (SIS) tunnel junctions with areas as small as 0.2 mu m(2). The fabrication of such ultrasmall area planar SIS junctions had previously only been achieved using electron beam lithography (JPL). Typical techniqu es for the fabrication of micron-scale SIS junctions involve a self-aligned resist lift-off process. The resist pattern is used to define both the jun ction counter-electrode and the insulation field that separates the wiring layer from the base electrode. The wiring layer contacts the junction count er-electrode through a,ia in the insulation field that is created during re sist liftoff. In our process, the junction is defined and insulated in sepa rate steps; a via through the insulation layer to the junction is aligned a nd defined using a gallium focused ion beam with nanometer spot-size. Such small area SIS junctions have potential applications in high frequency SIS mixer circuits. They may also be used in experiments to investigate quantum coherence in superconducting circuits and may even serve as the key elemen ts in future superconducting quantum computers.