We report on a study of long term aging in three different types of YBa2Cu3
O7-x Josephson junctions. Junction aging will affect the choices made in in
tegrating this technology with actual applications. The junction types used
in this study are (a) Go-doped barrier edge SNS junctions, (b) noble-metal
SNS step-edge junctions, and (c) bicrystal junctions which are either unpa
ssivated or passivated in situ with a normal metal shunt or an epitaxial in
sulator. While all the junctions show degradation, for some the long term s
urvival rate is encouraging.