A method to continuously combine and deform silver, er has been developed.
This technique has been used to fabricate multifilament superconducting tap
es consisting of Bi-2223, high temperature superconducting precursors. Resu
lts show that silver has the unique ability to be bonded together in a cont
inuous strand process without requiring a protective atmosphere, The approa
ch uses a continuous process to combine relatively fine wires that are alig
ned in the desired configuration, held in intimate contact and heat-treated
to promote metallurgical bonding. Silver grain growth across strand interf
aces has been documented in processed tapes and lengths approaching 100 met
ers have been fabricated. Engineering critical current densities (J(e),) as
high as 19,000 amps/cm(2) (77K, self-field, 1 mu V/cm) have been recorded
in short samples.