Quench propagation properties in HTS pancake coil

Citation
S. Shimizu et al., Quench propagation properties in HTS pancake coil, IEEE APPL S, 9(2), 1999, pp. 1077-1080
Citations number
4
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
ISSN journal
10518223 → ACNP
Volume
9
Issue
2
Year of publication
1999
Part
1
Pages
1077 - 1080
Database
ISI
SICI code
1051-8223(199906)9:2<1077:QPPIHP>2.0.ZU;2-6
Abstract
In this paper, we present the results of experiments and computer simulatio ns to make clear the quench propagation properties in Bi-2223/Ag supercondu cting multifilament tape. We developed a computer code based on the two-dim ensional finite element method (2-D FEM). Computed voltage and temperature traces during a quench agree well with the experimentally recorded voltage and temperature traces. Good agreement validates the computer code, making a useful tool in developing protection strategies for high-temperature supe rconducting (HTS) coils. Therefore, we simulate the quench process in a sin gle pancake coil wound with Bi-2223/Ag superconducting multifilament tape w ith background magnetic filed up to 10 T at 20 K using the developed comput er code. The quench propagation properties and stability in HTS coils are d iscussed and compare with those in low-temperature superconducting (LTS) co ils.